by XU Meihui

Chinese chipmakers highlighted progress in packaging, EDA tools and FPGAs at Shanghai's China International Industry Fair, which runs from Sept. 23 to 27. The fair's chip section, a core part of the event, brings together over 70 global firms across design, manufacturing and testing.

Shanghai-based Xpeedic Technology won CIIF's top prize with its 3DIC Chiplet simulation platform "Metis" - the first time a Chinese EDA tool has received the award. Founder DAI Wenliang said 3D stacking and heterogeneous integration are now central to extending computing power as Moore's Law slows. Metis reduces memory use by 95% and runs simulations up to 10 times faster than rivals, a capability increasingly required for AI workloads.

Industry executives say chip packaging and testing is one of the few segments where China is close to global rivals, with three mainland firms among the world's top 10. Global players are also investing in 3D stacking to raise performance and cut costs. For Chinese firms, urgency is heightened by curbs on advanced lithography and reliance on foreign EDA tools.

Anlogic Infotech, a homegrown Chinese FPGA designer, showcases its SALPHOENIX FPGA and SALDRAGON SoC series, which marketing director YAO Yang said have already been deployed at scale in communications, industrial control, machine vision and lidar. He called FPGAs a "third pillar" of China's high-performance computing architecture alongside CPUs and GPUs.

Yao said China still lacks a leading chipmaker on par with U.S. giants, but Shanghai's policy support, talent pool and large market are helping firms speed the path from lab to market.

Shanghai has made integrated circuits one of its three priority industries and is setting up a semiconductor fund estimated at about 100 billion yuan ($14 billion). At a forum during CIIF, TANG Wenkan, a deputy director at the municipal industry regulator, said the city aims to build a world-class electronics cluster and strengthen international cooperation.

Global demand remains strong. The World Semiconductor Trade Statistics group forecasts worldwide sales will grow 15.4% to $728 billion in 2025. Analysts say Chinese chipmakers must speed the path to commercialization to secure a bigger market share.